Title:
ELECTROMAGNETIC SHIELD FILM AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/188548
Kind Code:
A1
Abstract:
Provided is an electromagnetic shield film which has excellent moldability into a three-dimensional shape without exhibiting a decline in adhesion properties. An electromagnetic shield film equipped with a substrate film and an electromagnetic shield layer, said electromagnetic shield film being characterized in that: the substrate film includes an ethylene terephthalate unit, and also includes an ethylene isophthalate unit and/or a diethylene terephthalate unit; the ethylene terephthalate unit in the substrate film constitutes 40-90 mol%; the total amount of the ethylene isophthalate unit and/or the diethylene terephthalate unit in the substrate film is 3-20 mol%; and metal particles and a cross-linked polyester resin are contained in the electromagnetic shield layer.
Inventors:
KIYONO YUSUKE (JP)
TAGA KEIKO (JP)
TAMARI NOBORU (JP)
TAGA KEIKO (JP)
TAMARI NOBORU (JP)
Application Number:
PCT/JP2022/044690
Publication Date:
October 05, 2023
Filing Date:
December 05, 2022
Export Citation:
Assignee:
TOYOBO MC CORP (JP)
International Classes:
H05K9/00; B32B27/18; B32B27/36; C08J7/044; C08K7/18; C08L67/00; H01B5/14
Domestic Patent References:
| WO2010055742A1 | 2010-05-20 |
Foreign References:
| JP2003226762A | 2003-08-12 | |||
| JP2006199917A | 2006-08-03 | |||
| JP2005259546A | 2005-09-22 | |||
| JP2008300720A | 2008-12-11 |
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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