RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED ARTICLE

WIPO Patent Application WO/2023/188549

A1

Provided are: a resin composition exhibiting a high crystallization rate and little deterioration of physical properties; a molded article; and a method for manufacturing a molded article. The resin composition comprises 1-15 parts by mass of a polyamide resin B per 100 parts by mass in total of a polyamide resin A and the polyamide resin B, and the difference between the melting point Tmb of the polyamide resin B and the melting point Tma of the polyamide resin A is 35-110°C. In the polyamide resin A, a diamine-derived structural unit contains 100-50 mol% of a meta-xylylenediamine-derived structural unit, and 70 mol% or more of a dicarboxylic acid-derived structural unit is derived from an α,ω-linear aliphatic C7-16 dicarboxylic acid. In the polyamide resin B, a diamine-derived structural unit contains 100-95 mol% of a para-xylylenediamine-derived structural unit, and 70 mol% or more of a dicarboxylic acid-derived structural unit is derived from an α,ω-linear aliphatic C7-16 dicarboxylic acid.

JPH044256	RESIN COMPOSITION
JPH0753798	[Title of Invention] Polyamide and its composition
WO/2002/049601	STRUCTURED COMPOSITION COMPRISING A HETERATOME POLYMER AND FIBERS

OGURO HATSUKI (JP)
AMANO AKIO (JP)

PCT/JP2022/044726

October 05, 2023

December 05, 2022

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MITSUBISHI GAS CHEMICAL CO (JP)

C08L77/06; B29C45/00; C08G69/26

WO2020225358A1	2020-11-12
WO2015022818A1	2015-02-19
WO2020174871A1	2020-09-03

JP2018177867A	2018-11-15
JP2015030119A	2015-02-16

SIKS & CO. (JP)

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