Title:
ELECTROMAGNETIC SHIELDING FILM, METHOD FOR PRODUCING SHIELDED PRINTED WIRING BOARD, AND SHIELDED PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/090726
Kind Code:
A1
Abstract:
The present invention provides an electromagnetic shielding film for the production of a shielded printed wiring board that has sufficiently low connection resistance and sufficiently good transmission characteristics. An electromagnetic shielding film according to the present invention is characterized by being composed of a protective layer, a shielding layer that is superposed on the protective layer, and an insulating adhesive layer that is superposed on the shielding layer, and is also characterized in that: the shielding layer is provided with a conductive bump on the insulating adhesive layer side; the insulating adhesive layer has a first insulating adhesive layer surface on the shielding layer side and a second insulating adhesive layer surface on the reverse side of the first insulating adhesive layer surface; and the surface roughness (Ra) of the second insulating adhesive layer surface is 0.5-2.0 μm.
Inventors:
TAKAMI KOUJI (JP)
AOYAGI YOSHIHIKO (JP)
KAMINO KENJI (JP)
WATANABE MASAHIRO (JP)
AOYAGI YOSHIHIKO (JP)
KAMINO KENJI (JP)
WATANABE MASAHIRO (JP)
Application Number:
PCT/JP2019/042153
Publication Date:
May 07, 2020
Filing Date:
October 28, 2019
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B7/025; H05K1/02; H05K3/28
Foreign References:
| JP2017010995A | 2017-01-12 | |||
| JP2017025280A | 2017-02-02 | |||
| JP2016157920A | 2016-09-01 | |||
| JP2013193253A | 2013-09-30 | |||
| JP2017535072A | 2017-11-24 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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