Title:
ELECTROMAGNETIC WAVE SHIELDING FILM, METHOD OF MANUFACTURING SHIELDED PRINTED WIRING BOARD, AND SHIELDED PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/090727
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave shielding film for manufacturing a shielded printed wiring board that has sufficiently small connection resistance between a ground circuit and a shielding layer. This electromagnetic wave shielding film is characterized by comprising a protective layer, a shielding layer that is stacked on the protective layer, and an adhesive layer that is stacked on the shielding layer, wherein a conductive bump is formed on the adhesive layer side of the shielding layer and the conductive bump has a volume of 30000 to 400000 μm3.
Inventors:
TAKAMI KOUJI (JP)
KAMINO KENJI (JP)
WATANABE MASAHIRO (JP)
KAMINO KENJI (JP)
WATANABE MASAHIRO (JP)
Application Number:
PCT/JP2019/042154
Publication Date:
May 07, 2020
Filing Date:
October 28, 2019
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B7/025; H05K1/02; H05K3/28
Foreign References:
| JP2017010995A | 2017-01-12 | |||
| JP2009200113A | 2009-09-03 | |||
| JP2012156457A | 2012-08-16 | |||
| JP2016157920A | 2016-09-01 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF: