Title:
ELECTROMAGNETIC WAVE SHIELD FILM AND PRODUCTION METHOD FOR ELECTROMAGNETIC WAVE SHIELD FILM
Document Type and Number:
WIPO Patent Application WO/2023/171731
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave shield film that has high volatile component permeability but also has sufficient high-frequency electromagnetic wave shielding characteristics. This electromagnetic wave shield film is formed by layering, in order, a protection layer, a metal vapor deposition layer, an electroplating layer, and a conductive adhesive layer. The electromagnetic wave shield film is characterized in that a plurality of through holes are formed in the electroplating layer, the through holes being filled with an insulating resin.
Inventors:
WATANABE MASAHIRO (JP)
TAKESHITA SIGEKI (JP)
TAKAMI KOUJI (JP)
TAKESHITA SIGEKI (JP)
TAKAMI KOUJI (JP)
Application Number:
PCT/JP2023/008944
Publication Date:
September 14, 2023
Filing Date:
March 09, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; H01L23/00; H01Q15/14
Domestic Patent References:
| WO2020196169A1 | 2020-10-01 |
Foreign References:
| JP2008283012A | 2008-11-20 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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