Title:
ELECTROMAGNETIC WAVE SHIELD FILM
Document Type and Number:
WIPO Patent Application WO/2022/255438
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave shield film which can be easily bonded to an adherend, has excellent adhesion properties and electrical connection stability, and also has excellent environmental resistance. An electromagnetic wave shield film 1 obtained by layering a metal layer 3, a first inorganic layer 4 and a conductive adhesive layer 5 in this order, wherein the thickness of the first inorganic layer 4 is 0.1-100nm, the conductive adhesive layer 5 contains a binder component and conductive particles, and the ratio of the thickness of the conductive adhesive layer 5 to the median diameter of the conductive particles is 0.2-3.5.
Inventors:
TAKESHITA SIGEKI (JP)
TAKAMI KOUJI (JP)
WATANABE MASAHIRO (JP)
TAKAMI KOUJI (JP)
WATANABE MASAHIRO (JP)
Application Number:
PCT/JP2022/022433
Publication Date:
December 08, 2022
Filing Date:
June 02, 2022
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B9/00; B32B15/08
Domestic Patent References:
| WO2011121801A1 | 2011-10-06 | |||
| WO2016136247A1 | 2016-09-01 |
Foreign References:
| JP2005056906A | 2005-03-03 | |||
| JP2003033994A | 2003-02-04 | |||
| JP2020024977A | 2020-02-13 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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