Title:
ELECTROMAGNETIC WAVE SHIELDING FILM, SHIELDED PRINTED WIRING BOARD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/147301
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electromagnetic wave shielding film that has sufficient folding endurance and a sufficiently high electromagnetic wave shielding property. An electromagnetic wave shielding film according to the present invention comprises a conductive adhesive layer, a shielding layer that is laminated upon the conductive adhesive layer, and an insulating layer that is laminated upon the shielding layer. The electromagnetic wave shielding film is characterized in that a plurality of openings are formed in the shielding layer, no breaks occur when folded 600 times according to the MIT folding endurance test delimited in JIS P8115:2001, and the electromagnetic wave shielding property of the electromagnetic wave shielding film at 200 MHz as measured using the KEC technique is 85 dB or greater.
Inventors:
KAMINO KENJI (JP)
YAMAUCHI SIROU (JP)
SHIRAKAMI JUN (JP)
MURAKAWA AKIRA (JP)
YAMAUCHI SIROU (JP)
SHIRAKAMI JUN (JP)
MURAKAWA AKIRA (JP)
Application Number:
PCT/JP2018/004112
Publication Date:
August 16, 2018
Filing Date:
February 07, 2018
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
DAINIPPON INK & CHEMICALS (JP)
DAINIPPON INK & CHEMICALS (JP)
International Classes:
H05K9/00; B32B3/18; B32B7/02; B32B15/08; B32B15/20
Domestic Patent References:
| WO2014192494A1 | 2014-12-04 |
Foreign References:
| JP2004273577A | 2004-09-30 | |||
| JP2000196285A | 2000-07-14 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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