Title:
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/131183
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave shielding film that has a shielding layer with a high adhesion strength, and that has excellent bending resistance. The electromagnetic wave shielding film according to the present invention has an isotropic electrically conductive adhesive layer, an insulating layer, and a metal layer laminated in that order, and is characterized in that a total thickness of the insulating layer and the metal layer is 0.5 µm or more and less than 20 µm.
Inventors:
KAMINO KENJI (JP)
Application Number:
PCT/JP2021/045730
Publication Date:
June 23, 2022
Filing Date:
December 13, 2021
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B7/025
Domestic Patent References:
| WO2020241835A1 | 2020-12-03 | |||
| WO2013183632A1 | 2013-12-12 | |||
| WO2020116409A1 | 2020-06-11 |
Foreign References:
| JP2018190973A | 2018-11-29 | |||
| JP2018061011A | 2018-04-12 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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