Title:
ELECTROMAGNETIC WAVE SHIELDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/074618
Kind Code:
A1
Abstract:
Provided are: an electromagnetic wave shielding material which has at least one magnetic layer containing magnetic particles and a resin, has a resin content in the magnetic layer of 5-40 mass% (exclusive of 40), has at least one adhesive layer, and has an elongation of 5.0-150.0% (exclusive of 150.0), as determined by a tensile test at 150ºC; and an electronic component and an electronic device which include said electromagnetic wave shielding material.
Inventors:
FUKAGAWA KIYOTAKA (JP)
Application Number:
PCT/JP2022/039511
Publication Date:
May 04, 2023
Filing Date:
October 24, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H05K9/00; B32B7/025; B32B27/00; B32B27/18; B32B27/40; C08J5/18; H01F1/28; H01Q17/00
Domestic Patent References:
| WO2018084235A1 | 2018-05-11 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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