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Title:
ELECTROMAGNETIC WAVE SHIELD MATERIAL, ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD OF USING ELECTROMAGNETIC WAVE SHIELD MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/074619
Kind Code:
A1
Abstract:
Provided are: an electromagnetic wave shield material that is a layered product having metal layers on the outermost surfaces on both sides, and one or more magnetic layers, and that has a penetrating portion that penetrates from one of two portions in lateral surfaces of the layered product to the other; an electronic component including the electromagnetic wave shield material; an electronic device; and a method of using the electromagnetic wave shield material.

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Inventors:
MIKAMI TATSUO (JP)
Application Number:
PCT/JP2022/039512
Publication Date:
May 04, 2023
Filing Date:
October 24, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H05K9/00; B32B7/025; B32B15/04; H01F1/37; H01Q1/52; H01Q17/00
Foreign References:
JP2021068279A2021-04-30
JP2017212239A2017-11-30
JP2014232842A2014-12-11
Attorney, Agent or Firm:
SIKS & CO. (JP)
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