ELECTRONIC APPARATUS COMPRISING FLEXIBLE PRINTED CIRCUIT BOARD

WIPO Patent Application WO/2022/186454

A1

An electronic apparatus according to an embodiment comprises: a frame; a housing comprising a first temple connected to one side of the frame, and a second temple connected to the other side of the frame; a first PCB positioned in the first temple; and a first FPCB and a second FPCB which are electrically connected to the first PCB, wherein the first FPCB may comprise a first overlapping unit which is drawn out in a first direction from the first PCB and overlaps the second FPCB, and a first branching unit which extends from the first overlapping unit and non-overlaps the second FPCB, and the second FPCB may comprise a second overlapping unit which is drawn out in the first direction from the first FPCB and overlaps the first FPCB, and a second branching unit which extends from the second overlapping unit and non-overlaps the first FPCB.

WO/2003/022024	PRINTED BOARD UNIT AND ELECTRONIC APPARATUS
JPH07306647	LED DISPLAY UNIT AND CIRCUIT BOARD CONNECTING METHOD
JPH10242615	ELECTRODE TREATING STRUCTURE OF BUTTERFLY TYPE SEMICONDUCTOR MODULE AND ELECTRODE TREATING METHOD

YANG HYUNMO (KR)
UHM JUNWHON (KR)
LEE JUNGKEUN (KR)
PARK YONGHYUN (KR)
JEONG JUNMYEONG (KR)
HONG MYEONGJAE (KR)

PCT/KR2021/017767

September 09, 2022

November 29, 2021

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SAMSUNG ELECTRONICS CO LTD (KR)

H05K1/14; G02B27/01; H05K1/11; H05K5/00

US20200379264A1	2020-12-03
KR20100136463A	2010-12-28
KR20190110492A	2019-09-30
US20130161078A1	2013-06-27
JP2016184626A	2016-10-20

BAE, KIM & LEE IP (KR)

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