Title:
ELECTRONIC APPARATUS AND CONNECTING COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/090224
Kind Code:
A1
Abstract:
Provided are an electronic apparatus and a connecting component which have a shield function and are capable of achieving a reduced size. The electronic apparatus comprises: a substrate including a first substrate portion and a second substrate portion which is disposed in a position facing the first substrate portion; a plurality of potential wires which are connected to the first substrate portion and the second substrate portion, and which have arbitrary potentials; and a plurality of signal wires which are connected to the first substrate portion and the second substrate portion, and to which signals are supplied. The first substrate portion includes, on the surface side facing the second substrate portion, an electronic component mount region. The plurality of potential wires are disposed outside the mount region.
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Inventors:
HIRANO KEIICHI (JP)
HORII AKIHIRO (JP)
NOMURA YOSHIYUKI (JP)
NIINA KEIJI (JP)
SAKAZUME KOSUKE (JP)
HORII AKIHIRO (JP)
NOMURA YOSHIYUKI (JP)
NIINA KEIJI (JP)
SAKAZUME KOSUKE (JP)
Application Number:
PCT/JP2019/034917
Publication Date:
May 07, 2020
Filing Date:
September 05, 2019
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H05K7/14; H05K1/14; H05K9/00
Domestic Patent References:
| WO2007116657A1 | 2007-10-18 |
Foreign References:
| JP2005183410A | 2005-07-07 | |||
| JP2016082021A | 2016-05-16 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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