Title:
ELECTRONIC CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2023/163069
Kind Code:
A1
Abstract:
The electronic circuit module according to the present invention comprises: an insulating body; at least one among a capacitor, a coil, an inductor via, and a coupling line having two conductors electromagnetically coupled with each other; a sealing resin covering a part of the insulating body; and a conductive film which covers at least a part of the sealing resin and is grounded. At least one among at least a part of the capacitor, the coil, the inductor via, and the coupling line is provided on at least one among the inside of the insulating body and a surface of the insulating body. The surface of the insulating body has an upper surface and a lower surface facing in opposite directions. The conductive film is in contact with at least the upper surface of the surface of the insulating body. At least one among at least a part of the capacitor, the coil, the inductor via, and the coupling line is electrically connected to the conductive film via a contact region on the surface of the insulating body, the contact region being in contact with the conductive film.
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Inventors:
YAMAMOTO ISSEI (JP)
KIN YOSHINORI (JP)
KIN YOSHINORI (JP)
Application Number:
PCT/JP2023/006558
Publication Date:
August 31, 2023
Filing Date:
February 22, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H01F27/00; H01F27/32; H01F27/36; H01G4/40; H03H7/075; H05K9/00
Domestic Patent References:
| WO2019216299A1 | 2019-11-14 |
Foreign References:
| JP2002124434A | 2002-04-26 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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