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Title:
ELECTRONIC CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2024/047981
Kind Code:
A1
Abstract:
An electronic circuit module (10) is for mounting on a motherboard (91) having an electric power supply source. The electronic circuit module (10) comprises: a photoelectric conversion unit (40) that performs conversion between an optical signal and an electric signal; a processor unit (20) that performs a computing process using the electric signal; an electric power conversion unit (50) that converts and supplies electric power from the electric power supply source to the photoelectric conversion unit (40) and the processor unit (20); and a package substrate (60) on which the photoelectric conversion unit (40), the processor unit (20), and the electric power conversion unit (50) are mounted. The photoelectric conversion unit (40), the processor unit (20), and the electric power conversion unit (50) are connected only through a conductor pattern formed on the package substrate (60).

Inventors:
WAKAOKA TAKUO (JP)
TAKAHASHI YOSHIFUMI (JP)
SHIMABUKURO RIKI (JP)
TANABE KENTARO (JP)
MURASE YASUHIRO (JP)
Application Number:
PCT/JP2023/020419
Publication Date:
March 07, 2024
Filing Date:
June 01, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01L25/04; H01L25/18
Domestic Patent References:
WO2021158500A12021-08-12
Foreign References:
US20200350255A12020-11-05
JP2015103764A2015-06-04
JPH11340414A1999-12-10
JP2018195723A2018-12-06
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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