Title:
ELECTRONIC COMPONENT HOLDING MEMBER AND ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2023/032093
Kind Code:
A1
Abstract:
Provided is an electronic component holding member (M1) comprising: an electronic component (3); a first substrate (1) including a first molded resin product (11) and a first metal pattern in which signal patterns (12, 13) and a grounding pattern (14) are formed on a non-planar surface; a second substrate (2) disposed above the first substrate (1) and including a second molded resin product (21) and a second metal pattern (22) formed on a non-planar surface so as to overlap with at least a portion of the first metal pattern; and grounding wiring (23) connecting the grounding pattern (14) with the second metal pattern (22).
Inventors:
HOSOKAI SHIGERU (JP)
Application Number:
PCT/JP2021/032168
Publication Date:
March 09, 2023
Filing Date:
September 01, 2021
Export Citation:
Assignee:
OLYMPUS MEDICAL SYSTEMS CORP (JP)
International Classes:
A61B1/04
Domestic Patent References:
| WO2016092986A1 | 2016-06-16 | |||
| WO2007058096A1 | 2007-05-24 |
Foreign References:
| JP2013180078A | 2013-09-12 | |||
| JP2014183520A | 2014-09-29 | |||
| JP2004077382A | 2004-03-11 | |||
| JP2018068667A | 2018-05-10 |
Attorney, Agent or Firm:
ITOH-SHIN PATENT OFFICE (JP)
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