Title:
ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, AND CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2022/138744
Kind Code:
A1
Abstract:
Provided are an electronic component, an electronic component manufacturing method, and a circuit module, all of which which make it possible to facilitate designing for improving the performance of an electronic component by increasing the degree of freedom of arrangement of an internal electrode and a via conductor inside the electronic component. This electronic component according to the present invention is provided with: an element body having an external surface; a via conductor disposed so as to penetrate at least a part of the element body in the thickness direction of the element body and make one end surface flush with the external surface of the element body; and a columnar electrode having a base end portion electrically connected to one end surface of the via conductor so as to protrude from the external surface of the element body in the thickness direction thereof. The length of the columnar electrode in the thickness direction is longer than the maximum width of the columnar electrode at the cross section orthogonal to the thickness direction thereof.
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Inventors:
OIE HIROFUMI (JP)
Application Number:
PCT/JP2021/047650
Publication Date:
June 30, 2022
Filing Date:
December 22, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/29; H01F41/04; H01G4/30; H05K9/00
Domestic Patent References:
| WO2010103756A1 | 2010-09-16 | |||
| WO2019059017A1 | 2019-03-28 |
Foreign References:
| JP2009147177A | 2009-07-02 | |||
| JP2009027125A | 2009-02-05 | |||
| JPH06314881A | 1994-11-08 | |||
| JPH0888470A | 1996-04-02 | |||
| JP2008198923A | 2008-08-28 | |||
| JPS6289118U | 1987-06-08 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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