Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/195740
Kind Code:
A1
Abstract:
In this electronic component, an electronic element has a first surface. An enclosing member having insulating properties has a second surface and is in close contact with the perimeter of the electronic element while exposing the first surface from the second surface. A wiring board faces a third surface consisting of the first surface and the second surface. A joining member having insulating properties is interposed between and joined to the third surface and the wiring board. Electrically conductive bumps are positioned between the third surface and the wiring board, electrically connecting the electronic element to the wiring board. The joining member has through holes which penetrate through from the third surface side to the wiring board side, and which accommodate the bumps. At least some of the through holes overlap the second surface when seen in a plan view.
More Like This:
| JPS5885615 | SURFACE ACOUSTIC WAVE FILTER |
| JPS56152315 | ELASTIC SURFACE WAVE FILTER |
Inventors:
OIKAWA AKIRA (JP)
KITANISHI SINICHIRO (JP)
KITANISHI SINICHIRO (JP)
Application Number:
PCT/JP2020/009965
Publication Date:
October 01, 2020
Filing Date:
March 09, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H03H3/08; H01L21/60; H03H9/25; H03H9/72
Domestic Patent References:
| WO2012132147A1 | 2012-10-04 |
Foreign References:
| JP2006120981A | 2006-05-11 | |||
| JPH0823259A | 1996-01-23 | |||
| JP2018201083A | 2018-12-20 |
Attorney, Agent or Firm:
IIJIMA, YASUHIRO (JP)
Download PDF: