Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/195741
Kind Code:
A1
Abstract:
Provided is an electronic component in which an insulative enclosure member is closely adhered to a periphery of the electronic element while exposing a first surface of the electronic element from a second surface of the enclosure member. A wiring board opposes a third surface composed of the first surface and the second surface. An insulative bonding member is interposed between the third surface and the wiring board and bonds the third surface and the wiring board together. An electrically conductive bump is positioned between the third surface and the wiring board, and electrically connects the electronic element and the wiring board. A first through-hole of the bonding member overlaps a vibrating region in the first surface in a transparent plan view. A second through-hole of the bonding member accommodates the bump. In a transparent plan view, at least a part of at least one of the first through-hole and the second through-hole overlaps the second surface.
Inventors:
KITANISHI SINICHIRO (JP)
OIKAWA AKIRA (JP)
OIKAWA AKIRA (JP)
Application Number:
PCT/JP2020/009966
Publication Date:
October 01, 2020
Filing Date:
March 09, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/02; H01L23/08; H03H3/08; H03H9/25; H05K1/18
Domestic Patent References:
| WO2012132147A1 | 2012-10-04 |
Foreign References:
| JP2006120981A | 2006-05-11 | |||
| JPH0823259A | 1996-01-23 | |||
| JP2018201083A | 2018-12-20 |
Attorney, Agent or Firm:
IIJIMA, YASUHIRO (JP)
Download PDF:
Previous Patent: ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Next Patent: POLYESTER FILM AND PRODUCTION METHOD THEREFOR
Next Patent: POLYESTER FILM AND PRODUCTION METHOD THEREFOR