Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/230715
Kind Code:
A1
Abstract:
Provided is a method for manufacturing an electronic component having good thermal deformation resistance of a fluororesin encapsulation member. The electronic component is manufactured by a method having: a step for covering, with a fluororesin, an electronic element attached to a wiring substrate; and a step for irradiating, with radiation, the fluororesin covering the electronic element. Preferably, the fluororesin is a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer. Preferably, the radiation is an electron beam. The acceleration voltage of the electron beam is preferably 50 kV or more. The irradiation energy of the electron beam is preferably 20 kGy or more in an absorption dose.
Inventors:
YOSHIKAWA GAKU (JP)
NAKATA KUNIHIKO (JP)
NAKATA KUNIHIKO (JP)
Application Number:
PCT/JP2020/018654
Publication Date:
November 19, 2020
Filing Date:
May 08, 2020
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
H01L23/29; C08L27/12; C09K3/10; H01L23/31; H01L33/54; H01L33/56
Foreign References:
| JP2000164900A | 2000-06-16 | |||
| JP2001102639A | 2001-04-13 | |||
| JP2004088004A | 2004-03-18 | |||
| JP2000228411A | 2000-08-15 | |||
| JPH0845972A | 1996-02-16 | |||
| JPS58219781A | 1983-12-21 | |||
| JP2013087162A | 2013-05-13 | |||
| JP2012214754A | 2012-11-08 | |||
| JP2010084150A | 2010-04-15 | |||
| JP2016046491A | 2016-04-04 | |||
| US20180057714A1 | 2018-03-01 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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