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Patent Searching and Data


Title:
RESIN COMPOSITION AND ULTRAVIOLET LIGHT-EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/230714
Kind Code:
A1
Abstract:
Provided are a resin composition that exhibits an excellent heat resistance and adhesiveness, and an ultraviolet light-emitting device that exhibits an excellent heat resistance and adhesiveness for the sealing part. A resin composition comprises a fluororesin and an inorganic filler, wherein the fluororesin contains a tetrafluoroethylene-derived constituent unit A, a hexafluoropropylene-derived constituent unit B, and a vinylidene fluoride-derived constituent unit C. The resin composition is characterized in that the molar ratio (A) of the constituent unit A to the sum of the constituent unit A, the constituent unit B, and the constituent unit C is at least 0.25, and the molar ratio (C) of the constituent unit C to the sum of the constituent unit A, the constituent unit B, and the constituent unit C is not more than 0.60.

Inventors:
YOSHIKAWA GAKU (JP)
NAKATA KUNIHIKO (JP)
ONODERA YU (JP)
Application Number:
PCT/JP2020/018653
Publication Date:
November 19, 2020
Filing Date:
May 08, 2020
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
H01L23/29; C08K3/013; C08K3/16; C08L27/12; C08L27/18; H01L23/31; H01L33/56
Domestic Patent References:
WO2004039883A12004-05-13
WO2014178288A12014-11-06
Foreign References:
JP2017532426A2017-11-02
US20170263833A12017-09-14
US20170229614A12017-08-10
JP2014185294A2014-10-02
JP2017149839A2017-08-31
JP2013175462A2013-09-05
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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