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Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/085204
Kind Code:
A1
Abstract:
An electronic component 100 comprises: an element 10; and an exterior body 20 that seals the element 10. The exterior body 20 has a first part 21 that includes a first resin material and a second part 22 that includes a second resin material. The first part 21 has a pipe structure having a through-hole 23. The through-hole 23 accommodates therein the element 10. The second part 22 is present in the through-hole 23 having the element 10 accommodated therein.

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Inventors:
NODA TOMOHIRO (JP)
CHANTHAKUL AKKAPONG (TH)
UEDA YASUHIKO (JP)
TANI SATOSHI (JP)
Application Number:
PCT/JP2022/041147
Publication Date:
May 19, 2023
Filing Date:
November 04, 2022
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G2/10; H01G4/224; H01G4/32; H01G4/38; H01G9/00; H01G9/08; H01G11/82; H01M50/103; H01M50/121; H01M50/124
Foreign References:
JPH11204376A1999-07-30
JPH0327037U1991-03-19
CN214410990U2021-10-15
JP2000100669A2000-04-07
JP2020155696A2020-09-24
JP2017163097A2017-09-14
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
Download PDF:
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