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Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/085205
Kind Code:
A1
Abstract:
An electronic component 100 comprises: an electronic component element body 110 having a first surface 110e and a second surface 110f and including a first internal electrode 43, a second internal electrode 40, a collecting electrode 30 which is a composite material of a conductive material and a resin material, and an exterior body 20 which seals the first internal electrode 43, the second internal electrode 40, and the collecting electrode 30; a first external electrode 120 formed on the first surface 110e; and a second external electrode 130 formed on the second surface 110f. The first internal electrode 43 and the second internal electrode 40 extend in between the first surface 110e and the second surface 110f, respectively have first portions 43a, 40c at the first surface 110e side, and respectively have second portions 43b, 40d at the second surface 110f side. The first portion 43a of the first internal electrode 43 is embedded in the collecting electrode 30. The collecting electrode 30 is connected to the first external electrode 120 in the first surface 110e. The second portion 40d of the second internal electrode 40 is connected to the second external electrode 130 in the second surface 110f.

Inventors:
UEDA YASUHIKO (JP)
NODA TOMOHIRO (JP)
CHANTHAKUL AKKAPONG (TH)
TANI SATOSHI (JP)
Application Number:
PCT/JP2022/041148
Publication Date:
May 19, 2023
Filing Date:
November 04, 2022
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G2/10; H01G4/224; H01G4/228; H01G4/32; H01G4/38; H01G9/00; H01G9/012; H01G9/048; H01G9/06; H01G9/08; H01G11/74; H01G11/82; H01M50/121; H01M50/534; H01M50/54
Domestic Patent References:
WO2021210367A12021-10-21
Foreign References:
JPH11204376A1999-07-30
JP2020155696A2020-09-24
JPS6136921A1986-02-21
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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