Title:
ELECTRONIC COMPONENT MODULE
Document Type and Number:
WIPO Patent Application WO/2006/109369
Kind Code:
A1
Abstract:
This invention provides an electronic component module comprising a laminated ceramic electronic component as a first electronic component and a circuit board as a second electronic component electrically connected to each other through a bonding material of an electrically conductive adhesive such as an electrically conductive resin material. An organic compound which lowers the work function of the electrode surface, for example, an amine compound free from an oxygen atom in its branched skeleton and containing a nitrogen atom, such as tetraethylenepentamine, triethylamine, tri-n-butylamine, or 1-aminodecane, is previously adsorbed onto a surface layer of an external electrode in the laminated ceramic electronic component and an electrode pad in the circuit board. According to the above constitution, the work function of the electrode surface can be reduced to increase a Schottky current, the resistance derived from connection between the electrode and a connecting material can be reduced, and an electronic component module having high electrical connection reliability can be realized.
Inventors:
NOMURA AKIHIRO (JP)
KAWAKAMI AKIHIKO (JP)
OSAWA TAKASHI (JP)
KAWAKAMI AKIHIKO (JP)
OSAWA TAKASHI (JP)
Application Number:
PCT/JP2006/302856
Publication Date:
October 19, 2006
Filing Date:
February 17, 2006
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
NOMURA AKIHIRO (JP)
KAWAKAMI AKIHIKO (JP)
OSAWA TAKASHI (JP)
NOMURA AKIHIRO (JP)
KAWAKAMI AKIHIKO (JP)
OSAWA TAKASHI (JP)
International Classes:
H01G4/40; H01G2/06; H01G4/12; H01G4/252; H01G4/30; H05K3/32
Foreign References:
| JPS61142438U | 1986-09-03 | |||
| JPH0661602A | 1994-03-04 |
Attorney, Agent or Firm:
Kunihiro, Yasutoshi (14-10 Nishinakajima 5-chome, Yodogawa-k, Osaka-shi Osaka, JP)
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