Title:
ELECTRONIC COMPONENT AND MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/218218
Kind Code:
A1
Abstract:
An electronic component comprising a main component body and an external electrode provided on the obverse surface of the main component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal. The at least one first metal is selected from the group consisting of metals in group 9 to group 11 of the Periodic Table of Elements. The at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, there is at least one portion in which the concentration of the at least one second metal continuously varies in the thickness direction of the external electrode and the concentration of the metal increases, and there is at least one portion in which the concentration of the at least one second metal continuously varies in the thickness direction of the external electrode and the concentration of the metal decreases.
Inventors:
KURODA SHIGEYUKI (JP)
ARAKAWA YUSUKE (JP)
YAMAMOTO CHIAKI (JP)
OTANI SHINJI (JP)
ARAKAWA YUSUKE (JP)
YAMAMOTO CHIAKI (JP)
OTANI SHINJI (JP)
Application Number:
PCT/JP2020/016963
Publication Date:
October 29, 2020
Filing Date:
April 17, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30
Domestic Patent References:
| WO2013132965A1 | 2013-09-12 |
Foreign References:
| JP2016076582A | 2016-05-12 | |||
| JP2004083955A | 2004-03-18 | |||
| JPH04334007A | 1992-11-20 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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