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Patent Searching and Data


Title:
ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/129985
Kind Code:
A1
Abstract:
An electronic component mounting substrate (51) according to an embodiment of the present invention comprises: a substrate (20); an electronic component (30) mounted on at least one surface of the substrate (20); and an electromagnetic wave shield member (1) which is covered from the upper surface of the electronic component (30) to the substrate (20), and covers at least a part of the substrate (20) and the side surface of a stepped portion formed by mounting the electronic component (30). The electromagnetic wave shield member (1) has an electromagnetic wave shield layer (5) containing a binder resin and a conductive filler. The kurtosis of the surface layer of the electromagnetic wave shield member (1) is 1 to 8 as measured in accordance with JIS B0601; 2001.

Inventors:
MATSUDO KAZUNORI (JP)
ANDO KENJI (JP)
HAYASAKA TSUTOMU (JP)
MATSUO TAMAKI (JP)
Application Number:
PCT/JP2019/049435
Publication Date:
June 25, 2020
Filing Date:
December 17, 2019
Export Citation:
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Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCHEM CO LTD (JP)
International Classes:
H05K9/00; H05K3/28
Domestic Patent References:
WO2011007570A12011-01-20
Foreign References:
JP2018129498A2018-08-16
JP2017079218A2017-04-27
JPH037331B21991-02-01
JP6597927B12019-10-30
JP2018170492A2018-11-01
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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