Title:
ELECTRONIC COMPONENT AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/072138
Kind Code:
A1
Abstract:
This production method for an electronic component uses an outer covering material that comprises a silicone resin, and includes: a step in which an element is dipped into an outer covering material comprising aluminum hydroxide or magnesium hydroxide that is added thereto in a controlled manner so as to be equal to or greater than 60 wt% and less than 70 wt% and a silicone resin to which a non-polar solvent has been added; a step in which the outer covering material that has formed on the surface of the element is dried, the non-polar solvent is evaporated, and the silicone resin composition is exposed on the surface of the outer covering material; and a curing step in which the outer covering material is cured. As a result, it is possible to reduce the amount of silicone resin while maintaining the incombustibility and the withstand voltage of the outer covering material.
Inventors:
AIZAWA SHOGO (JP)
Application Number:
PCT/JP2014/005679
Publication Date:
May 21, 2015
Filing Date:
November 12, 2014
Export Citation:
Assignee:
NIPPON CHEMICON (JP)
International Classes:
H01C17/02; C09D7/61; H01C1/034; H01C7/10
Foreign References:
| JP2010192539A | 2010-09-02 | |||
| JP2005277100A | 2005-10-06 | |||
| JP2013145794A | 2013-07-25 | |||
| JPH09199308A | 1997-07-31 | |||
| JP2013199571A | 2013-10-03 | |||
| JP2006002029A | 2006-01-05 | |||
| JPH06215910A | 1994-08-05 | |||
| JP2005277100A | 2005-10-06 | |||
| JP2006286986A | 2006-10-19 |
Other References:
See also references of EP 3070720A4
Attorney, Agent or Firm:
UNEMOTO, Shoichi et al. (JP)
Shoichi Unemoto (JP)
Shoichi Unemoto (JP)
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