Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/123995
Kind Code:
A1
Abstract:
According to the present invention, one surface of a first substrate is provided with a first ground-side land, a first power supply-side land, and a first signal land. A second substrate is arranged so as to face the surface of the first substrate, on which the first ground-side land is provided. A surface of the second substrate, which faces the first substrate, is provided with a second ground-side land, a second power supply-side land, and a second signal land. A ground-side connection conductor connects the first ground-side land and the second ground-side land to each other. A power supply-side connection conductor connects the first power supply-side land and the second power supply-side land to each other. A filter element, which is arranged between the first substrate and the second substrate, is connected to the first signal land and the second signal land.
Inventors:
NABEKURA SYUICHI (JP)
Application Number:
PCT/JP2018/043576
Publication Date:
June 27, 2019
Filing Date:
November 27, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/14; H03H7/09; H05K1/18; H05K3/36
Domestic Patent References:
| WO2014129008A1 | 2014-08-28 |
Foreign References:
| JP2006295136A | 2006-10-26 | |||
| JP2014011284A | 2014-01-20 | |||
| JP2008004853A | 2008-01-10 |
Attorney, Agent or Firm:
KITAYAMA, Mikio et al. (JP)
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