Title:
ELECTRONIC COMPONENTS ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2012/056661
Kind Code:
A1
Abstract:
[Problem] To reduce the mismatching of impedance at a connected part when electronic components are electrically connected to each other.
[Solution] An electronic components assembly, wherein electronic components (1, 2) are electrically connected to each other, and wherein a wiring line (11) formed the surface (1a) of the first electronic component (1) and a wiring line (12) formed on the surface (2a) of the second electronic component (2) face each other and are bonded to each other through an electrically conductive material (13), thereby electrically connecting the first electronic component (1) to the second electronic component (2). The electrically conductive material (13) is a resin composition containing a solder or an electrically conductive filler.
Inventors:
TAKASHITA HIROMITSU (JP)
TAKEDA TSUYOSHI (JP)
KONNO YUKO (JP)
FUJIWARA HIROAKI (JP)
YOSHIOKA SHINGO (JP)
TAKEDA TSUYOSHI (JP)
KONNO YUKO (JP)
FUJIWARA HIROAKI (JP)
YOSHIOKA SHINGO (JP)
Application Number:
PCT/JP2011/005895
Publication Date:
May 03, 2012
Filing Date:
October 20, 2011
Export Citation:
Assignee:
PANASONIC CORP (JP)
TAKASHITA HIROMITSU (JP)
TAKEDA TSUYOSHI (JP)
KONNO YUKO (JP)
FUJIWARA HIROAKI (JP)
YOSHIOKA SHINGO (JP)
TAKASHITA HIROMITSU (JP)
TAKEDA TSUYOSHI (JP)
KONNO YUKO (JP)
FUJIWARA HIROAKI (JP)
YOSHIOKA SHINGO (JP)
International Classes:
H01L25/065; H01L21/60; H01L25/07; H01L25/18
Foreign References:
| JP2010056202A | 2010-03-11 | |||
| JP2008294318A | 2008-12-04 | |||
| JP2005136402A | 2005-05-26 | |||
| JP2000150575A | 2000-05-30 | |||
| JPH0595210A | 1993-04-16 | |||
| JPH08298272A | 1996-11-12 | |||
| JPH08321671A | 1996-12-03 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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Claims: