Title:
ELECTRONIC CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/091596
Kind Code:
A1
Abstract:
Provided is an electronic control device that has improved heat dissipation performance and that makes it possible to prevent thermal interference between electronic components without hindering high-speed communication when the electronic components are positioned near each other. The present invention has a circuit substrate 3 on which a plurality of electronic components are provided. The circuit substrate 3 has at least a first region RA in which a first electronic component 4a is positioned, and a second region RB in which a second electronic component 4b is positioned. The first electronic component 4a in the first region RA is thermally connected to a first housing body 1 via a first thermal conduction function unit 8a1, 5a1, and the second electronic component 4b in the second region RB is thermally connected to a second housing body 2 via a second thermal conduction function unit 8b1, 5b1.
Inventors:
TERANISHI MINAMI (JP)
ICHIKAWA EIJI (JP)
HODA ISAO (JP)
ICHIKAWA EIJI (JP)
HODA ISAO (JP)
Application Number:
PCT/JP2021/033226
Publication Date:
May 05, 2022
Filing Date:
September 10, 2021
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H05K7/20; B60R16/02; H01L23/36; H05K1/02
Foreign References:
| JP2015135852A | 2015-07-27 | |||
| JP2004259948A | 2004-09-16 | |||
| JP2016171210A | 2016-09-23 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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