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Patent Searching and Data


Title:
ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND DESIGN ASSISTANCE METHOD FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/059041
Kind Code:
A1
Abstract:
Provided is an electronic device comprising: a substrate including an insulating film, a wiring layer and a via provided to the insulating film, and a plurality of power source pads and a plurality of ground pads which are provided to the insulating film so as to surround a capacitor region in which a capacitor is provided, and to which a plurality of bumps are connected; and an electronic component which is mounted on the substrate, and which is electrically connected, via the wiring layer and the via, to the plurality of power source pads and the plurality of ground pads. The electronic device is configured so that at least one of the following is satisfied: the plurality of power source pads include, in a line adjacent to the capacitor region and running along a side of the outer shape of the capacitor region, one or more first power source pads that are contacted by the via and one or more second power source pads for which the total surface area contacted by the via is less than that of the one or more first power source pads; and the plurality of ground pads include, in a line adjacent to the capacitor region and running along a side of the outer shape of the capacitor region, one or more first ground pads that are contacted by the via and one or more second ground pads for which the total surface area contacted by the via is less than that of the one or more first ground pads.

Inventors:
KAWAI KENICHI (JP)
Application Number:
PCT/JP2018/034611
Publication Date:
March 26, 2020
Filing Date:
September 19, 2018
Export Citation:
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Assignee:
FUJITSU LTD (JP)
International Classes:
H01L23/12; H01L25/00
Foreign References:
US20050162839A12005-07-28
JP2004006488A2004-01-08
JP2013062309A2013-04-04
JP2010251754A2010-11-04
Other References:
See also references of EP 3855482A4
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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