Title:
ELECTRONIC DEVICE COMPRISING COMPONENT BRACKET HAVING HEAT RADIATION PATTERN FORMED THEREON
Document Type and Number:
WIPO Patent Application WO/2023/229229
Kind Code:
A1
Abstract:
An electronic device according to various embodiments of the present disclosure comprises: a housing; a component bracket arranged in the housing, the component bracket having a first recess formed in a first surface facing a first direction, and a second recess that is spaced apart from the first recess and is formed adjacent to an edge of the housing; a heat-generation source which is seated in the second recess and is arranged so that a plurality of surfaces thereof are surrounded by the component bracket; and a circuit board comprising a first portion seated in the first recess, and a second portion which extends from one end of the first portion and is inserted into the second recess so as to be electrically connected to the heat-generation source. The component bracket may comprise a first heat radiation pattern formed on a second surface that is opposite to the first surface, and a second heat radiation pattern formed on a third surface which is perpendicular to the first surface, is adjacent to the heat-generation source, and faces the edge of the housing.
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Inventors:
KANG HYOSUNG (KR)
SUNG HAEWON (KR)
SUNG HAEWON (KR)
Application Number:
PCT/KR2023/005187
Publication Date:
November 30, 2023
Filing Date:
April 17, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G06F1/20; H01Q1/24; H01Q1/38; H05K7/20
Foreign References:
| KR20200117553A | 2020-10-14 | |||
| KR20190140209A | 2019-12-19 | |||
| KR20210093198A | 2021-07-27 | |||
| KR20200132041A | 2020-11-25 | |||
| JP2018182651A | 2018-11-15 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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