Title:
ELECTRONIC DEVICE HOUSING, ELECTRONIC DEVICE, AND COMBINED BODY
Document Type and Number:
WIPO Patent Application WO/2020/062890
Kind Code:
A1
Abstract:
Provided are an electronic device housing, an electronic device, and a combined body. The electronic device housing comprises: a frame body; a sealing layer provided on at least a part of the outer surface of the frame body, the sealing layer comprising a plurality of sealing sub-layers stacked in sequence; and a back housing connected to the frame body by means of the sealing layer, wherein the components of two adjacent sealing sub-layers are different.
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Inventors:
MA LAN (CN)
JIN HAIYAN (CN)
PAN LING (CN)
YU NA (CN)
CHEN LIANG (CN)
JIN HAIYAN (CN)
PAN LING (CN)
YU NA (CN)
CHEN LIANG (CN)
Application Number:
PCT/CN2019/087230
Publication Date:
April 02, 2020
Filing Date:
May 16, 2019
Export Citation:
Assignee:
BYD CO LTD (CN)
International Classes:
H05K5/02
Foreign References:
| CN107613069A | 2018-01-19 | |||
| CN106657505A | 2017-05-10 | |||
| CN203167461U | 2013-08-28 | |||
| US20110318591A1 | 2011-12-29 |
Other References:
See also references of EP 3860319A4
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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