ELECTRONIC DEVICE INCLUDING HOUSING HAVING THROUGH-HOLE FORMED THEREIN

WIPO Patent Application WO/2024/019361

A1

According to an embodiment of the present disclosure, an electronic device may be provided, the electronic device comprising: a housing including a first plate, a side member having a thickness of a first width, a seating portion which is a portion of the side member and on which the edge of the first plate can be seated, and a through-hole penetrating from the outer surface toward the inner surface of a designated region of the side member and having a first depth that is substantially the same as the first width; a socket module including a conductive socket, which is inserted into the through-hole and has a first surface exposed to the outside of the housing and has a second surface opposite to the first surface and exposed to the inside of the housing, and an elastic member arranged to surround the periphery of the second surface of the conductive socket and being in contact with the periphery of the through-hole at the inner surface; and a circuit board having arranged thereon a conductive contact member, wherein the circuit board has the conductive contact member arranged to be electrically connected to the circuit board while contacting the second surface of the conductive socket. Various other embodiments may also be applied.

CHUN JUNGHO (KR)

PCT/KR2023/009237

January 25, 2024

June 30, 2023

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SAMSUNG ELECTRONICS CO LTD (KR)

G06F1/16; H01R13/24

JP2000306639A	2000-11-02
KR20220020996A	2022-02-21
JP2011108479A	2011-06-02
KR20080040456A	2008-05-08
KR20020047878A	2002-06-22

LEE, Keon-Joo et al. (KR)

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