ELECTRONIC DEVICE, JOINING MATERIAL, AND METHOD FOR PRODUCING ELECTRONIC DEVICE

Title:

ELECTRONIC DEVICE, JOINING MATERIAL, AND METHOD FOR PRODUCING ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2013/047137

Kind Code:

A1

Abstract:

The present invention has: a printed substrate (2) having land electrodes (1a, 1b); and a chip-type electronic component (5) wherein external electrodes (4a, 4b) are formed at the surface of a component element (3). The land electrodes (1a, 1b) and the external electrodes (4a, 4b) are joined with solder (6) therebetween, forming electrode joining sections (7a, 7b), and a thermosetting resin (8) fills the space between the electrode joining sections (7a, 7b). A joining material contains solder particles having a melting point (T1), a thermosetting resin having a curing temperature that is higher than the melting point (T1), and an active agent having an active temperature (T3) that is lower than the curing temperature (T2), and the viscosity of the components contained aside from the solder particles at the melting point (T1) is no greater than 0.57 Pa·s and the melting point (T1) and active temperature (T3) satisfy the relationship T1 - T3 < 50. Thus, an electronic device having favorable reliability of insulating properties and electrical connectivity and having favorable mechanical strength, a joining material suitable for the production of the electronic device, and a method for producing the electronic device using the joining material are achieved.

Inventors:

NOMURA AKIHIRO (JP)
TAKAOKA HIDEKIYO (JP)

Application Number:

PCT/JP2012/072699

Publication Date:

April 04, 2013

Filing Date:

September 06, 2012

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)
NOMURA AKIHIRO (JP)
TAKAOKA HIDEKIYO (JP)

International Classes:

H05K3/32

Domestic Patent References:

WO2009107342A1

2009-09-03

Foreign References:

JP2008293820A	2008-12-04
JP2011181467A	2011-09-15
JP2010034504A	2010-02-12
JP2008510620A	2008-04-10
JP2006150413A	2006-06-15

Other References: