ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2021/256426

A1

Provided are an electronic device and a manufacturing method capable of electrically joining, with high position accuracy, an external connection terminal onto a metal wiring pattern formed on a thermoformable base material while reducing the number of components.　The present invention comprises: a base material that is made of a synthetic resin material and is deformable from a substantially flat two-dimensional shape into a substantially three-dimensional shape; an external connection terminal for electrically connecting a metal wiring pattern disposed on the base material to an external element provided outside the base material and contacting the metal wiring pattern in a recessed section that is shaped into a three-dimensional shape in the thickness direction of the base material by thermoforming the base material; a resin layer that covers at least one surface of the base material and forms a housing surrounding the external connection terminal so that a terminal surface, which is a surface of the external connection terminal, is exposed; a joining means for electrically joining the metal wiring pattern and the external connection terminal in the recessed section; and a coating layer that fills a recessed portion and covers the joining means.

SUGIMOTO MASAAKI (JP)
YOKOYAMA HIDEAKI (JP)
OITA YUICHI (JP)
FUJIMAKI KIYOSHI (JP)

PCT/JP2021/022517

December 23, 2021

June 14, 2021

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ELEPHANTECH INC (JP)
TAKAHATA PREC CO LTD (JP)

H01L23/12; H05K1/11; H05K3/00; H05K3/18; H05K3/28

WO2019130861A1	2019-07-04
WO2016185750A1	2016-11-24

JPS63265487A	1988-11-01
JPH05206619A	1993-08-13
JPH0730218A	1995-01-31

SEZAKI Yukinori (JP)

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