Title:
ELECTRONIC DEVICE AND MULTILAYER CERAMIC SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/042846
Kind Code:
A1
Abstract:
This electronic device comprises a substrate with an electronic component mounted thereon, wherein the electronic component is provided with a connection terminal on a mounting surface side thereof, the connection terminal being R-shaped when observed in cross-section view. This multilayer ceramic substrate comprises a surface electrode for connecting to the connection terminal, and is characterized in that: a recess is provided on a mounting surface of the multilayer ceramic substrate, the recess being R-shaped when observed in cross-section view and being formed at a position that corresponds to the connection terminal; and the surface electrode is provided to at least a portion of the recess, and is conductive with the connection terminal.
Inventors:
OKA TAKAHIRO (JP)
TAKEMORI YUKI (JP)
KISHIDA KAZUO (JP)
KAWAKAMI HIROMICHI (JP)
YAMAMOTO YUKIO (JP)
OTAKE KENSUKE (JP)
TAKEMORI YUKI (JP)
KISHIDA KAZUO (JP)
KAWAKAMI HIROMICHI (JP)
YAMAMOTO YUKIO (JP)
OTAKE KENSUKE (JP)
Application Number:
PCT/JP2017/023542
Publication Date:
March 08, 2018
Filing Date:
June 27, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/18; H01L21/60; H01L23/13; H05K3/34
Foreign References:
| JPH11121527A | 1999-04-30 | |||
| JP2008021751A | 2008-01-31 | |||
| JPH0241476U | 1990-03-22 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF: