Title:
ELECTRONIC DEVICE PROCESSING TAPE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE PROCESSING TAPE
Document Type and Number:
WIPO Patent Application WO/2022/270073
Kind Code:
A1
Abstract:
Provided is electronic device processing tape comprising a base material tape laminated with a release film. The base material tape comprises a label section, a residue peeling section, and a peripheral section. The label section has a prescribed shape in a plan view and is formed at a prescribed interval in a conveyance direction of the electronic device processing tape. The residue peeling section surrounds an outer side of the label section in a plan view, and is such that a residue section having an interval portion forming the prescribed interval is detached. The peripheral section contacts an outer edge of the residue peeling section in a plan view. A cutting line forming the outer edge of the residue section and extending from the front in the conveyance direction and a cutting line forming the outer edge of the residue section and extending from the rear in the conveyance direction do not intersect, and at the interval portion of the residue section, an end of the cutting line extended from one direction is positioned further in a direction of the peripheral section than an end of the cutting line extending from another direction, or the end of the cutting line extending from the one direction and the end of the cutting line extending from the other direction are positioned in parallel in relation to the conveyance direction.
Inventors:
TSUCHIYA TAKANORI (JP)
Application Number:
PCT/JP2022/013441
Publication Date:
December 29, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/683; C09J7/38
Foreign References:
| JP2019210301A | 2019-12-12 | |||
| JP2009188323A | 2009-08-20 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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