Title:
ELECTRONIC DEVICE PROCESSING TAPE AND PRODUCTION METHOD FOR ELECTRONIC DEVICE PROCESSING TAPE
Document Type and Number:
WIPO Patent Application WO/2022/270074
Kind Code:
A1
Abstract:
This electronic device processing tape is provided with a release film and a base material tape layered thereon. The base material tape has: label parts that are formed at a prescribed interval along the conveyance direction of the electronic device processing tape and that have a prescribed plan-view shape; a rim-removed part having removed therefrom a rim part that surrounds the plan-view outside of the label parts and that has interval portions forming the prescribed interval; and a peripheral part that is in contact with the outer edge of the rim-removed part in plan view. The electronic device processing tape has intersections in each of which cut lines that extend from the front side in the conveyance direction and that form the outer edge of a rim part intersect with cut lines that extend from the rear side in the conveyance direction and that form the outer edge of a rim part at an interval portion between the rim parts. A first cut line extension portion that is of a cut line extending from one side and that extends from an intersection to the terminal end is positioned closer to the peripheral part than a virtual line that extends from the intersection and that is parallel to the conveyance direction.
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Inventors:
TSUCHIYA TAKANORI (JP)
Application Number:
PCT/JP2022/013442
Publication Date:
December 29, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/683; C09J7/38
Foreign References:
| JP2009188323A | 2009-08-20 | |||
| JP2019210301A | 2019-12-12 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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