Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/123668
Kind Code:
A1
Abstract:
Provided is an electronic device having a new structure contributing towards a reduction in size. This invention is provided with a first substrate 12A, a second substrate 12B, and a resin casing 11. Wiring, including a signal line for electrically connecting the first substrate 12A and the second substrate 12B, is formed on the resin casing 11. The wiring formed on the resin casing may include a ground. The invention may further be provided with a connection member for connecting the first substrate 12A and/or the second substrate 12B with the signal line, and a grounding member for connecting the first substrate 12A and/or the second substrate 12B with the ground.
Inventors:
HIRAMATSU NOBUKI (JP)
NISHIZAKA NAOKI (JP)
NISHIZONO MITSUHIRO (JP)
SAGALA DJUNIADI ARIFIN (JP)
NISHIZAKA NAOKI (JP)
NISHIZONO MITSUHIRO (JP)
SAGALA DJUNIADI ARIFIN (JP)
Application Number:
PCT/JP2017/045206
Publication Date:
July 05, 2018
Filing Date:
December 15, 2017
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01P3/00; H01Q1/24; H04M1/02
Domestic Patent References:
| WO2012074100A1 | 2012-06-07 |
Foreign References:
| JP2012044640A | 2012-03-01 | |||
| JP2008005037A | 2008-01-10 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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