Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/195301
Kind Code:
A1
Abstract:
[Problem] To efficiently cool down heat of a heating element 20. [Solution] This electronic device 100 is provided with a circuit board 10, a case 30, and a connection part 40. The circuit board 10 has a heating element 20 that is attached to a first main surface 11 thereof. The case 30 has an opening part 31 that is formed in a surface facing the heating element 20. The case 30 also houses a refrigerant COO therein. The connection part 40 connects the opening part 31 and the heating element 20 so as to enclose the refrigerant COO. The connection part has a thickness of at most 0.21 mm.
Inventors:
HACHIYA MAHIRO (JP)
YOSHIKAWA MINORU (JP)
OHTSUKA TAKASHI (JP)
KANEKO NOBUO (JP)
YOSHIKAWA MINORU (JP)
OHTSUKA TAKASHI (JP)
KANEKO NOBUO (JP)
Application Number:
PCT/JP2020/005719
Publication Date:
October 01, 2020
Filing Date:
February 14, 2020
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
H01L23/427; F28D15/02; G06F1/20; H05K7/20
Domestic Patent References:
| WO2015174423A1 | 2015-11-19 |
Foreign References:
| JP2006261457A | 2006-09-28 | |||
| JP2008518468A | 2008-05-29 | |||
| JP2009206369A | 2009-09-10 | |||
| JP2009139005A | 2009-06-25 |
Attorney, Agent or Firm:
SHIMOSAKA Naoki (JP)
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