Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/193621
Kind Code:
A1
Abstract:
The present invention effectively inhibits leakage of electromagnetic waves in the surroundings of a heat dissipation device. A heat dissipation device (80) has: a plurality of fins (81) disposed inside an opening (52a); a heat pipe (83) having a connection part (83a) that is positioned between the plurality of fins (81) and a circuit board (50) and that extends in the lateral direction along the circuit board (50); and a base plate (82) that supports the plurality of fins (81). The base plate (82) has a left plate part (82c). The left plate part (82c) covers the bottom surface, which faces the substrate shield (52) side of the heat pipe (83), and closes off a gap (G1) between the left end of the plurality of fins (81) and the right edge of the opening (52a) of the substrate shield (52)
Inventors:
SUGAWARA NOBUYUKI (JP)
ITO KATSUSHI (JP)
ITO KATSUSHI (JP)
Application Number:
PCT/JP2021/011967
Publication Date:
September 30, 2021
Filing Date:
March 23, 2021
Export Citation:
Assignee:
SONY INTERACTIVE ENTERTAINMENT INC (JP)
International Classes:
H05K9/00; H05K7/20
Foreign References:
| JP2001057405A | 2001-02-27 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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