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Patent Searching and Data


Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/181143
Kind Code:
A1
Abstract:
This electronic device comprises: a substrate (10) having a ground pattern (11) provided on a surface so as to surround the periphery of a mounted electronic component (20); and a shield case (30) that has spring leg parts (40A) that extend from lower edges of side plates (32, 33) toward the surface of the substrate (10) via a plurality of bent parts (44, 45), the shield case (30) being attached to the surface of the substrate (10) via fixing surfaces of fixing parts (36) so as to cover the periphery of the electronic component (20). The spring leg parts (40A) extend toward the outside of the shield case (30) from a second bent part (45) that is disposed on the frontmost end side among the plurality of bent parts (44, 45), and have flat surfaces on flat parts (43) that come into contact with the ground pattern (11). The flat surfaces of the flat parts (43) are disposed further toward the substrate (10) side than the fixing surfaces of the fixing parts (36) and are parallel to the contact surface of the ground pattern (11).

Inventors:
OTSUBO HIKARU (JP)
KANAYA SHIGEYUKI (JP)
Application Number:
PCT/JP2022/013361
Publication Date:
September 28, 2023
Filing Date:
March 23, 2022
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K9/00; H05K1/02
Foreign References:
JPH10294585A1998-11-04
JPS6310597U1988-01-23
JP2000101278A2000-04-07
US7351107B12008-04-01
JP2011249689A2011-12-08
JP2005322692A2005-11-17
JP2007142230A2007-06-07
JP2009224393A2009-10-01
Attorney, Agent or Firm:
SANNO PATENT ATTORNEYS OFFICE (JP)
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