Title:
ELECTROSTATIC CHUCK
Document Type and Number:
WIPO Patent Application WO/2019/078182
Kind Code:
A1
Abstract:
This electrostatic chuck 10 has a structure wherein an electrostatic electrode 16 is embedded in a circular disk-shaped ceramic plate 12; and this electrostatic chuck 10 sucks a wafer W, which is placed on the ceramic plate 12 and has a diameter smaller than that of the ceramic plate 12, by means of Johnsen-Rahbek effect. This electrostatic chuck 10 has an insulating film 14 that has a higher electrical resistance than the ceramic plate 12 in an annular region of the surface of the ceramic plate 12 from the outer circumferential edge of the ceramic plate 12 to the inside of the outer circumferential edge of the wafer W, which is placed on the ceramic plate 12.
Inventors:
WATANABE REO (JP)
KONDOU NOBUYUKI (JP)
UNNO YUTAKA (JP)
KONDOU NOBUYUKI (JP)
UNNO YUTAKA (JP)
Application Number:
PCT/JP2018/038410
Publication Date:
April 25, 2019
Filing Date:
October 16, 2018
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L21/683
Foreign References:
| JP2007050468A | 2007-03-01 | |||
| JP2009500835A | 2009-01-08 | |||
| JP2006060040A | 2006-03-02 | |||
| JPH1126565A | 1999-01-29 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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