Title:
ENDOSCOPE TIP STRUCTURE AND ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2019/244290
Kind Code:
A1
Abstract:
Provided are an endoscope tip structure and an endoscope, which prevent positional displacement of an imaging module within a frame body and which minimize spills of an adhesive filled therein. The endoscope tip structure according to the present invention is characterized by being provided with: an imaging module which generates an image signal by performing, by means of an imaging element, photoelectric conversion on a subject image formed by an optical unit and which then transmits the image signal via a cable; a frame body which has formed therein a through-hole penetrating in an optical axis direction of the optical unit and which retains the imaging module in a state of being inserted in the through-hole from an insertion opening provided to a base end of the frame body; a first adhesive which at least bonds together at least a portion of a base-end side perimeter of a resin sealing part that seals an area from a base end side of a lateral face portion of the optical unit through to a connection of the cable and at least a portion of an inner circumferential surface in the vicinity of the insertion opening in the frame body; and a second adhesive which is filled in a gap between the through-hole in the frame body and the imaging module that is kept inserted in the through-hole so as to bond together the frame body and the imaging module.
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Inventors:
SATAKE NAU (JP)
Application Number:
PCT/JP2018/023530
Publication Date:
December 26, 2019
Filing Date:
June 20, 2018
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/00; A61B1/04; G02B23/24
Foreign References:
| JP2015073540A | 2015-04-20 | |||
| JP2015073537A | 2015-04-20 | |||
| JP2015039547A | 2015-03-02 | |||
| JP2016030027A | 2016-03-07 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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