ENERGY RAY-CURABLE RESIN COMPOSITION AND ADHESIVE USING SAME

WIPO Patent Application WO/2006/129678

A1

Disclosed is an energy ray-curable resin composition exhibiting equally high adhesion to various objects such as glasses, metals and plastics, while having good heat resistance, moisture resistance and excellent rigidity. In particular, this energy ray-curable resin composition has low curing shrinkage and little adhesion strain. Specifically disclosed is an energy ray-curable resin composition characterized by containing (A) a (meth)acrylate having a molecular weight of 500-5000 wherein the main chain backbone is at least one selected from a group consisting of polybutadienes, polyisoprenes and hydrogenated products of those, and at least one (meth)acryloyl group is contained at an end of the main chain backbone or in a side chain; (B) a monofunctional (meth)acrylate having an unsaturated hydrocarbon group having 2-8 carbon atoms via an ester bond; (C) a hydroxyl group-containing (meth)acrylate; (D) a polyfunctional (meth)acrylate; (E) a photopolymerization initiator; and (F) an antioxidant.

WATANABE JUN (JP)
YODA KIMIHIKO (JP)
OSHIMA KAZUHIRO (JP)

PCT/JP2006/310812

December 07, 2006

May 30, 2006

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DENKI KAGAKU KOGYO KK (JP)
WATANABE JUN (JP)
YODA KIMIHIKO (JP)
OSHIMA KAZUHIRO (JP)

C08F290/04; C09J4/06

JPH09194547A	1997-07-29
JPH09302053A	1997-11-25
JPH11147921A	1999-06-02
JP2000234043A	2000-08-29
JP2001055420A	2001-02-27
JPS5616561A	1981-02-17
JP2006225460A	2006-08-31

Senmyo, Kenji (SIA Kanda Square 17, Kanda-konyach, Chiyoda-ku Tokyo 35, JP)

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