EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE

WIPO Patent Application WO/2022/123994

A1

The purpose of the present invention is to provide an epoxy resin composition that exhibits an excellent deformation-resistant flexibility and adherence to substrates, can easily be detached after use, and tis suitable for use as a structural adhesive. Specifically provided is an epoxy resin composition that comprises an epoxy resin (A) expressed by formula (1) and having an epoxy equivalent weight of 500-10,000 g/eq [in formula (1), Ar is an aromatic ring; X is a structural unit having an alkylene chain; Y is a structural unit having a polyether chain; R11 and R12 are a glycidyl ether group or 2-methylglycidyl ether group; R13 and R14 are a hydroxyl group, glycidyl ether group, or 2-methylglycidyl ether group; R15 and R16 are a hydrogen atom or methyl group; m1 and m2 are 0-25 and m1 + m2 ≥ 1; p1 and p2 are 0-5; and q is 0.5-5.], an epoxy resin (B) having an epoxy equivalent weight of 100-300 g/eq, and heat-expandable particles (C).

JP4929623	Thermosetting resin composition containing a modified polyimide resin
JPH05278134	PRODUCTION OF MULTILAYERED RESIN FILM HAVING PRINTING PATTERN LAYER INCORPORATED THEREIN
WO/2021/229930	MOISTURE BARRIER LAMINATED FILM

OTSU MASATO (JP)
ARITA KAZUO (JP)

PCT/JP2021/041446

June 16, 2022

November 11, 2021

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DAINIPPON INK & CHEMICALS (JP)

B32B27/00; B32B27/38; C08G59/20; C08J9/32; C08K9/10; C08L63/00; C09J163/00

WO1999046320A1	1999-09-16
WO1999043758A1	1999-09-02

JP2006225544A	2006-08-31
JP2000336318A	2000-12-05
JP2003171648A	2003-06-20
JP2014111698A	2014-06-19
JP2003176459A	2003-06-24
JP2000044219A	2000-02-15
JPS4226524B1	1967-12-15
JP2002226620A	2002-08-14

OGAWA Shinji (JP)

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