EPOXY RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, AND ADHESIVE

Title:

EPOXY RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, AND ADHESIVE

Document Type and Number:

WIPO Patent Application WO/2023/127800

Kind Code:

A1

Abstract:

An epoxy resin composition containing an epoxy resin (A) and a curing agent (B) having heteroatoms, the molecular weight α of the curing agent (B) having the heteroatoms being 200≤α≤1200, and the value of α/β, which is the ratio of the molecular weight α to the number β of the heteroatoms in the structure of the curing agent (B) having the heteroatoms, being 30≤α/β≤95.

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Inventors:

OKAMOTO RYOSUKE (JP)
KAMIMURA NAOYA (JP)
ONIZUKA KENZO (JP)

Application Number:

PCT/JP2022/047933

Publication Date:

July 06, 2023

Filing Date:

December 26, 2022

Export Citation:

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Assignee:

ASAHI CHEMICAL IND (JP)

International Classes:

C08G59/40; C08K3/013; C08K5/101; C08K5/15; C08L63/00; C09J163/00; H01L23/29; H01L23/31

Domestic Patent References:

WO2010147161A1	2010-12-23
WO2002051905A1	2002-07-04
WO2022014646A1	2022-01-20

Foreign References:

JP2009120683A	2009-06-04
JP2008001857A	2008-01-10
JP2003096061A	2003-04-03
JP2003026772A	2003-01-29
JP2000229927A	2000-08-22
JPS6440515A	1989-02-10
JP2003055638A	2003-02-26
JPH02145677A	1990-06-05
JP2021038314A	2021-03-11

Other References:

KUMAGAI YAOMI, KEI URABE, KIYOSHI KEMMOCHI: "Anisotropic Measurement of Short Glass Fiber-Epoxy Composites Obtained by Rotational Molding Apparatus", KOBUNSHI RONBUNSHU, vol. 58, no. 1, 1 January 2001 (2001-01-01), pages 50 - 55, XP093076139, DOI: 10.1295/koron.58.50
HIDEKI NIINO, SABURO NOGUCHI, YOSHIMOTO NAKANO, SHIGEO TAZUKE: "Aminimide as Hardener/Curing Promotor for One Part Epoxy Resin Composition", JOURNAL OF APPLIED POLYMER SCIENCE, JOHN WILEY & SONS, INC., US, vol. 27, 30 November 1981 (1981-11-30), US , pages 2361 - 2368, XP009534095, ISSN: 0021-8995

Attorney, Agent or Firm:

INABA, Yoshiyuki et al. (JP)

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