Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/127708
Kind Code:
A1
Abstract:
Provided is an alicyclic epoxy resin composition which can maintain excellent dielectric properties and which exhibits more significantly improved reaction speed with an active ester curing agent, as compared to the prior art. More specifically, the present invention provides an epoxy resin composition which contains (A) a hydroxy group-containing compound, (B) an epoxy resin, (C) a curing agent, and (D) a curing accelerator. The epoxy resin (B) contains an alicyclic epoxy resin having no glycidyl group. The curing agent (C) contains an active ester curing agent.
Inventors:
HARISAKI RYOTA (JP)
Application Number:
PCT/JP2022/047513
Publication Date:
July 06, 2023
Filing Date:
December 23, 2022
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08G59/62; H05K1/03
Foreign References:
| JP2021042295A | 2021-03-18 | |||
| JP2016027097A | 2016-02-18 | |||
| JP2015010153A | 2015-01-19 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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