Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/127709
Kind Code:
A1
Abstract:
Provided is an alicyclic epoxy resin composition that maintains excellent dielectric properties and exhibits a remarkably improved reaction rate with an active ester curing agent as compared with conventional compositions. More specifically, provided is an epoxy resin composition comprising (A) a hydroxy group-containing compound, (B) an epoxy resin, (C) a curing agent, and (D) a curing accelerator, wherein the (A) hydroxy group-containing compound has a molecular weight of at least 200, the (B) epoxy resin includes an alicyclic epoxy resin having no glycidyl ether group, and the (C) curing agent includes an active ester curing agent.
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Inventors:
HARISAKI RYOTA (JP)
Application Number:
PCT/JP2022/047514
Publication Date:
July 06, 2023
Filing Date:
December 23, 2022
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08G59/62; H05K1/03
Domestic Patent References:
| WO2018131569A1 | 2018-07-19 | |||
| WO2018131567A1 | 2018-07-19 |
Foreign References:
| JP2021042295A | 2021-03-18 | |||
| JP2016027097A | 2016-02-18 | |||
| JP2020158703A | 2020-10-01 | |||
| JP2005206672A | 2005-08-04 | |||
| JP2015010153A | 2015-01-19 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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