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Title:
EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, GAS BARRIER ADHESIVE AGENT, AND GAS BARRIER LAMINATE BODY
Document Type and Number:
WIPO Patent Application WO/2013/161480
Kind Code:
A1
Abstract:
Provided are: an epoxy resin curing agent that can cause the realization of high gas barrier properties and favorable adhesion to various plastics, particularly polyesters; an epoxy resin composition; a gas barrier adhesive agent containing the epoxy resin composition; and a gas barrier laminate body and the like having high gas barrier properties and favorable adhesion to various plastics, particularly polyesters. The epoxy resin curing agent is the reaction product of the belowmentioned (A) and (B). Also, the epoxy resin curing agent contains at least an epoxy resin and the epoxy resin curing agent. (A) is meta-xylylene diamine or para-xylylene diamine, and (B) is an unsaturated carboxylic acid represented by formula (1) and/or a derivative thereof (in formula (1), R1 represents an alky group having 1-8 carbon atoms, an aralkyl group having 1-8 carbon atoms, or an aryl group).

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Inventors:
HONDA EIICHI (JP)
KOUNO KAZUKI (JP)
Application Number:
PCT/JP2013/058636
Publication Date:
October 31, 2013
Filing Date:
March 25, 2013
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
HENKEL AG & CO KGAA (DE)
International Classes:
C08G59/44; B32B15/08; B32B27/38; C07C233/38; C09J163/00
Domestic Patent References:
WO2011132637A12011-10-27
WO2011115020A12011-09-22
WO1999060068A11999-11-25
Foreign References:
JP2010012708A2010-01-21
JP2009523876A2009-06-25
JPH0791367B21995-10-04
JPH0791368B21995-10-04
JPH09511537A1997-11-18
JP2002256208A2002-09-11
JPH0551574A1993-03-02
JPH09316422A1997-12-09
JP2000154365A2000-06-06
Other References:
See also references of EP 2842982A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
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